| |
| | |
| | Professional Surface-mounting and Through-hole soldering technology |
| Various sizes like 1206,0805,0603 components SMT technology |
| ICT(In Circuit Test),FCT(Functional Circuit Test) |
| PCB Assembly With UL,CE,FCC,Rohs Approval |
| Nitrogen gas reflow soldering technology for SMT. |
| High Standard SMT&Solder Assembly Line |
| High density interconnected board placement technology capacity. |
| Components | Passive Down to 0201 size |
| BGA and VFBGA |
| Leadless Chip Carriers/CSP |
| Double-sided SMT Assembly |
| Fine Pitch to 0.8mils |
| BGA Repair and Reball |
| Part Removal and Replacement |
| Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized |
| Type of Assembly | SMT, Thru-hole |
| Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| Bare Board Size | Smallest:0.25*0.25 inches |
| Largest:20*20 inches |
| File Formate | Gerber files, Pick-N-Place file, Bill of Materials |
| Types of Service | Turn-key,partial turn-key or consignment |
| Component packaging | Cut Tape,Tube,Reels,Loose Parts |
| Turn Time | Same day service to 15 days service |
| Testing | Flying Probe Test,X-ray Inspection AOI Test |
| PCB assembly process | Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave
Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing |
