Guangzhou Highleap Electronic Co.,Ltd.
Guangzhou HighLeap Electronic Co.,ltd.
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FR4 Custom Core Amplifier B Speaker Power Bank Pcb Manufacturer
| PCB Item | Manufacture Capacity |
| Layer Counts | custom |
| Base Material | FR4,High-TG FR4,CEM3,aluminum,High Frequency |
| Material Thickness(mm) | 0.4, 0.6, 0.8, 1.0, 1.2, 1.5, 1.6, 2.0, 2.4, 3.2 |
| Max board size(mm) | 1200x400mm |
| Board Outline Tolerance | ±0.15mm |
| Board Thickness | 0.2mm0.4mm0.6mm0.8mm1.0mm...... |
| Thickness Tolerance | ±8% |
| Minimum line/space | 0.1mm |
| Min Annular Ring | 0.1mm |
| SMD Pitch | 0.3mm |
| Holes | |
| Min Hole Size(mechanical) | 0.2mm |
| Min Hole Size(laser hole) | 0.1mm |
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
| Hole Position Tol | ±0.075mm |
| Plating | |
| HASL/LF HAL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-5u'' |
| Surface Finish | HASL,ENIG,Plated Gold,Immersion Gold,OSP |
| Copper | |
| Copper Weight | 0.5--6oz |
| Color | |
| Solder mask | Green, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Silk screen | White, Black, Blue,Yellow |
| Acceptable File Format | Gerber file,CAM-350,CAM2000 |
| Certificate | ROSH,CE |