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| | Professional Surface-mounting and Through-hole soldering technology. |
| Various sizes like 1206,0805,0603 components SMT technology. |
| ICT(In Circuit Test),FCT(Functional Circuit Test). |
| PCB Assembly With UL,CE,FCC,Rohs Approval. |
| Nitrogen gas reflow soldering technology for SMT.. |
| High Standard SMT&Solder Assembly Line. |
| High density interconnected board placement technology capacity.. |
| Components | Passive Down to 0201 size. |
| BGA and VFBGA. |
| Leadless Chip Carriers/CSP. |
| Double-sided SMT Assembly. |
| Fine Pitch to 0.8mils. |
| BGA Repair and Reball. |
| Part Removal and Replacement. |
| Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized. |
| Type of Assembly | SMT, Thru-hole. |
| Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free. |
| Bare Board Size | Smallest:0.25*0.25 inches. |
| Largest:20*20 inches. |
| File Formate | Gerber files, Pick-N-Place file, Bill of Materials. |
| Types of Service | Turn-key,partial turn-key or consignment. |
| Component packaging | Cut Tape,Tube,Reels,Loose Parts. |
| Turn Time | Same day service to 15 days service. |
| Testing | Flying Probe Test,X-ray Inspection AOI Test. |
| PCB assembly process | Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave
Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing. |
