Hot Sales Customized Flexible Printed Circuit Board FPC Assembly flex PCB Service Manufacturers
| | | | Special |
| | Production Capability | Single-sided:20,000M²/Month | N/A |
| Double-sided/Multi-layers:10,000M²/Month | N/A |
| | Base Material | Polyimide (Kapton) ( PI ) | Polyester (PET) |
| | Layers | Flexible Printed Circuit(FPC) Board:1~6 layers | 8 Layers |
| Rigid-Flex Board:2~6 layers | 8 Layers |
| | Maximum Size | 250*1200mm | 500*1200mm |
| | Maximum Thickness | 0.75mm | N/A |
| | Minumum Thickness | 0.05mm | N/A |
| | Product thickness tolerance | ± 0.03mm | ± 0.02mm |
| | Copper Thickness | 12um (1/3OZ),18um (1/2OZ) , 35um (1OZ), 70um (2oz) | 6um(1/4OZ), 140um (4OZ) |
| | Minimum Line Width/ Distance between stitchings | ± 0.05mm | ± 0.03mm |
| | Stiffener material type | PI / FR4 / PET / Steel piece | N/A |
| | Etching tolerance | ± 0.02mm | N/A |
| | Minimum Hole Diameter | 0.1mm | N/A |
| | Hole tolerance | PTH: +/- 0.05mm
NPTH: +/-0.03mm | N/A |
| | Outline profile | Punching , Laser cut | N/A |
| | Outline Dimension tolerance | ± 0.1mm | ± 0.05mm |
| | Solder mask color | Yellow,Black,white | Green,Red,Blue |
| | Surface treatment | OSP: 0.2-0.5um
ENIG: Au 0.03um - 0.15um
Immersion Tin:0.5-1.5um
Immersion silver: 0.1-1.2um
Gold plating: Au 1-150U’’ | HASL : 1- 20um |
| | Thermal shock test | 288 ± 5 ℃ , 10S , 3times | N/A |
| | Environmental Requirement | ROHS | N/A |
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