Guangzhou Highleap Electronic Co.,Ltd.  

Guangzhou HighLeap Electronic Co.,ltd.

Manufacturer from China
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FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication

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Guangzhou Highleap Electronic Co.,Ltd.  
City:guangzhou
Country/Region:china
Contact Person:MrHoward
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FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication

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Brand Name :HighLeap
Model Number :PCB Board
Certification :ISO9001/Iso14001/CE/ROHS
Place of Origin :China
MOQ :1pcs
Price :USD 1-30 piece
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :10000 piece per week
Delivery Time :1-15 working days
Packaging Details :Vacuum Package
Product name :Printed Circuit Board....
Copper Thickness :0.5oz-12oz....
Application :Electronics Device....
Surface Finishing :HASL\OSP\immersion Gold\ENIG....
Certificate :CE/ISO/ROHS....
Base Material :FR4+ROGERS/ROGERS+ROGERS...
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View Product Description

Multilayer PCB
Special Tech
Place of Origin:
China
1.Impedance

2.Via Filling

3.PFH,Backdrill

4.Mix Finishes

5.Cave

6.Heatsink

7.ENEPIG
Brand Name:
Highleap
Application Segment:
Auto,Industrial,Medical,DataCom,Consumer
Layer Count:
4~50L
Matierial:
FR4 (Tg130~Tg170)
Board Thickness(mm):
0.6mm~10.0mm
Copper Thickness(oz):
Hoz~3oz
Size(mm):
5mm~1200mm
Min. LW/LS(mm):
0.1/0.1
Min. Hole(mm):
0.25
Solder Mask:
Green, Yellow, Blue, Black, White...
Surface Finish:
ENIG,OSP,HASL,Imm Tin,Imm Silver...
Certificate:
RoHS/ISO9001/ISO14001
Service:
OEM
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FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication
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